Master Electronics Thermal Management with Ansys Icepak

Course Description

This course will demonstrate how Ansys Icepak is a useful tool for solving thermal problems involving natural and forced convection, circuit board thermal problems, and conjugated heat transfer problems.

Course Content

The course is intended for people who want to learn how to solve heat transfer problems in electric cooling applications. This is an entry-level course suitable for those who have had little or no experience with Ansys Icepak.

After completion of this course you will be able to:

• Design electric cooling to prevent excess heating
• Understand how the different components in PCB effects the heating
• Import geometry from ECAD layout tools (e.g. Altium, Zuken and Mentor Graphics)

Prerequisites: No prerequisites are required, but it is recommended to have some prior basic knowledge from electronic circuit board setup, heat transfer basic phenomena (convection, conduction, radiation) and flow dynamics.

Audience: Engineers

Duration & location:

This class room training is held over 3 days, between 9:00 am to approximately 5:00 pm. It will be held at Junakatu 9, Turku. A training computer is included in the price.